TAK Technology
Soft ferrite · NiZn & MnZn
From formulation to core
TAK / Company profile 2027
05 / Cores by circuit
Circuit 01

Cores by circuit

TTechnology
AAssurance
KKeeper

Buck converter — output inductor

The inductor sits in series on the output side: large DC, small AC swing, so the design is governed by saturation (DC bias), not by core loss.

  • LOutput storage inductorLook at hot Bs and the air gap first, then at loss; multiphase in parallel = VRM/TLVR
CIRCUIT · BUCKVinSLDCRVo

Band → material

BandFirst choiceAlternativeNote
Buck ≦0.1 MHzTM82—Bs 600 mT, gapped for DC bias
Buck 0.1–0.5 MHzTM71—By IDC: μi 3800 + high Bs
Buck 0.5–0.8 MHzTM59★—
Buck 0.8–3 MHzTM65★TM61TM63
Buck ≦0.3 MHz—TM80TM83★TP44TP45When loss matters; high temperature (core up to 140 ℃)
VRM/TLVR ≦0.1 MHzTM82—
VRM/TLVR 0.1–0.5 MHzTM71—
VRM/TLVR 0.5–0.8 MHzTM59★—
VRM/TLVR 0.8–1 MHzTM65★TM61
VRM/TLVR ≦0.3 MHz—TM80TM83★
NiZn——Parts on this page are mainly MnZn; no TAK NiZn counterpart is listed; for mA-level small inductors see circuit 11

Suggested shapes

3D · illustrativeUDChoose a series ▾
Strengths
  • Vertical mounting, small PCB footprint
  • Suits high-current inductors with a single turn or copper-clip winding
  • Withstands DC bias; switching frequencies of 0.7 MHz and above
Trade-offs
  • Taller
  • Mainly for high-current VRM/TLVR use
3D · illustrativeU+IChoose a series ▾
Strengths
  • Horizontal U+I combination, low height
  • Suits high-current inductors with a single turn or copper-clip winding
  • Withstands DC bias; switching frequencies of 0.7 MHz and above
Trade-offs
  • Larger PCB footprint
  • Two-piece assembly; AL consistency must be controlled
3D · illustrativeSP+IChoose a series ▾
Strengths
  • Excellent shielding, low leakage flux
  • Easy PCB mounting, easy winding
  • Combines with I/R/DR into low-leakage SMD inductors
Trade-offs
  • Weaker heat dissipation
  • Two-piece assembly
3D · illustrativeDR (NiZn, mA level)Choose a series ▾
Strengths
  • Open magnetic circuit, withstands DC bias
  • Simplest winding
  • Can be paired with an SP/SRI shield cap to reduce leakage flux
Trade-offs
  • High leakage flux when used alone; watch EMI
  • Inductance limited by the open magnetic circuit

Where it goes

AI data center

VRM and TLVR for GPUs/CPUs; on-board PoL

New-energy vehicles

ECU/ADAS processor power

Consumer · industrial

On-board buck on motherboards, networking and industrial-control boards

Overview ⤢ ←→Switch chapter · EscBack to overview